Odisha Shines At Semicon India 2025 With Indigenous Chip Innovation

New Delhi : Odisha made a powerful impression at the Semicon India 2025 summit with the inauguration of its state pavilion by Chief Minister Mohan Charan Majhi, officials said on Tuesday. The pavilion showcased the state’s growing prowess in semiconductor innovation, including a standout contribution from engineering students of Parala Maharaja Engineering College, Berhampur. The students developed a cuttingedge chip card designed to track criminal activities, drawing attention from national and international delegates. This innovation highlights Odisha’s potential in security tech and embedded systems. Two major semiconductor projects—SiCSem and 3DGS— were also presented, both of which have received Union Cabinet approval. SiCSem is investing ?2,500 crore to establish India’s first commercial silicon carbide semiconductor fab in Bhubaneswar, while 3DGS will set up an advanced packaging
and embedded glass substrate unit in the same region. In addition, companies like ARF and Scaledge showcased their technologies, reinforcing Odisha’s emergence as a key player in India’s semiconductor ecosystem. The pavilion also featured Odisha’s IT policy and digital infrastructure roadmap, positioning the state as a future hub for electronics manufacturing and innovation. Union Education Minister Dharmendra Pradhan emphasized that Odisha’s growing semiconductor footprint will create significant employment opportunities and contribute to India’s goal of becoming a global semiconductor hub

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